STIPT – Calls

Winter Semester 2026/27

The application link through Mobility Online will be published here November 15, 2025.

Please submit your application for participation in the program online via Mobility Online within the period of the call. After submitting the application form, you will receive a registration request by email. You can then upload the following application documents online in the workflow section:

  • Certificate of enrollment
  • Transcript of Records (TOR)
  • Proof of your English language proficiency (at least B2 CEFR)
  • Bachelor’s degree certificate or preliminary diploma (if available)
  • Curriculum Vitae (CV) in English
  • Practical experience relevant to the semiconductor industry (optional)
  • Language skills in Mandarin (optional)


In addition, an electronic reference must be submitted by your home university. This must be written by a person relevant to your field of study, whom you designate in the application form. We recommend contacting this person in advance and informing her/him about the program, yourself, and your plans.

More detailed information can be found in the Mobility Online portal during application periods.


Please note:
All documents must be fully uploaded to Mobility Online no later than the application deadline. Unfortunately, incomplete applications cannot be considered. We therefore recommend that you submit your application early and do not wait until the last day. If you have any questions or need advice, please feel free to contact Leonardo-Sachsen.

In an online information event, you will learn more about the opportunities of studying in Taiwan, the practical training at TSMC, and the conditions on site in Taiwan. Questions about the application process and the application criteria will also be answered.

Information event November 27, 2005/ 9 a.m. / ➚Link TEAMS (tba.)

After the event,  presentation slides can be downloaded here.

In addition, during the application period, there will be opportunities for online consultation (see contact box). 

Application period: November 15, 2025 – December 12, 2025 (12:00 noon)
LeoSachsen selection process: December 15, 2025 – January 30, 2026
Selection committee process: February 2, 2026 – February 27, 2026
Announcement of selected students: March, 2026
Arrival date for each Taiwanese university will be communicated in good time.
Start of teaching persiod at Taiwanese partner universities: September 1, 2026 (tbc.)
Practical training at TSMC: following the period of study until the beginning of the Chinese New Year (details will be provided in good time)

Summer Semester 2026 (Call closed)

Please submit your application for participation in the program online via Mobility Online. After submitting the application form, you will receive a registration request by email. You can then upload the following application documents online in the workflow section:

  • Certificate of enrollment
  • Transcript of records
  • Proof of your English language proficiency
  • Bachelor’s degree certificate or preliminary diploma
  • Practical experience relevant to the semiconductor industry (optional)
  • Language skills in Mandarin (optional)


In addition, an electronic reference must be submitted by your home university. This should be written by a person relevant to your field of study, whom you designate in the application form. We recommend contacting this person in advance and informing her/him about the program, yourself, and your plans.

More detailed information can be found in the Mobility Online portal during application periods.

Through STIPT the Saxon universities cooperate with various Taiwanese universities. The course program for the summer semester 2027 will be conducted by National Taiwan University (NTU) and consists of teaching modules highly relevant to the semiconductor industry. The following modules are expected to be offered. Changes remain at the discretion of the Taiwanese partner university and will be communicated as soon as they become known:

Modul Device / Integration:

  • Solid State Electronics
  • Integrated Circuit Technology
  • Strength of Materials
  • Practical Training at TSMC


Modul Tool / Equipment Engineering:

  • Integrated Circuit Technology
  • Electronic Circuits
  • Digital Control System
  • Practical Training at TSMC


Modul Intelligent Manufacturing

  • Operations Research
  • Artificial Intelligence
  • Machine Learning
  • Practical Training at TSMC


To harmonize the German exam period, which usually lasts until the end of February, with the spring semester in Taiwan, which usually begins in mid-February, the STIPT course program starts in February with online modules. From the beginning of March, the course program continues in Taiwan with mandatory in-person attendance. Therefore, arrival in Taiwan can take place either Mid-February or March 1, depending on the individual participants preference.

After completing the course program at the host university (around mid-June), the transition takes place to a two-month practical training at TSMC in the Newcomer Training Center & Fab in Taichung.

Application period via Mobility Online: May 1 (four weeks)

First arrival date: February 21, 2026 

Online courses:  February 23, 2026 – February 29, 2026

(Participation is a mandatory part of the scholarship program. These courses can be completed either in Germany or already in Taiwan. Important: If participation in the online courses is not possible during the exam period, further participation in the STIPT program is excluded.)

Second arrival date:
March 1, 2026

In-person courses at the Taiwanese partner universities:
March 2, 2026 – June 5, 2026

Practical training at TSMC:
Mid-June – Mid-August 2026

Contact:

Juan Manuel Barragan
Project Manager STIPT

Email: international.leosachsen@tu-dresden.de
Tel.: +49 351 463 37688

During the application phase, we ➚online consultation on the following dates: November 10, November 17, and December 1, from 1–2 p.m.

Feel free to connect with us online through ➚LinkedIn.