Students and Graduates 〉 Internships abroad 〉 STIPT 〉 Calls
STIPT – Calls
Winter Semester 2027/28 (Call will open November 15, 2026)
STIPT-Online Information Event November 27, 2026 at 9 a.m. (Please, register!)
The information event for students provides insight into the STIPT program and will feature representatives from NTUST and TSMC as speakers. We kindly ask you to ➚register before the event; the participation link will be sent out in due time.
Date and Time: November 27, 2026, 9:00 a.m.
Further information and registration: ➚Event details and registration
Application (from November 15 until December 15, 2026 - noon)
The link to the application platform will be available at this location starting November 15, 2026.
Note: The entire application process takes place in English. Please complete your application in the portal entirely in English and submit your documents in English – where possible.
Please submit your application for participation in the program online via Mobility Online. After submitting the application form, you will receive a registration request by email.
The application and selection process consists of three phases:
1. Verification of eligibility requirements
After registering, please first upload only your Transcript of Records (TOR) – preferably in the English version – for your current study program. Based on the TOR, we will check whether you meet the formal requirements for participation. A grade average of 2.3 (German scale) or better is required to continue in the selection process. For the calculation of the grade point average, please refer to the ➚guide to calculating your grade average.
2. Submission of application requirements
Applicants who meet the eligibility requirements will be admitted to the second phase and will be able to upload the remaining application documents via the workflow section in Mobility Online.
These include:
- Certificate of enrollment
- Curriculum vitae (CV) in English
- Proof of your English proficiency (B2 CEFR):
- Official tests and certificates (e.g., IELTS, TOEIC, Cambridge, etc.)
- Proof of English proficiency issued by organizations or universities (e.g., DAAD, Education First, university certificates, German Abitur)
- Proof of a passed English module (as shown in your TOR)
- Bachelor’s degree certificate or pre-diploma (Vordiplom) (optional)
- Letter of recommendation from a qualified person in your field (e.g., professor, research associate, etc.); a mentor or employer from the field of microelectronics, in English (optional)
- Documentation of practical experience relevant to the semiconductor industry (preferably in English, optional)
- Proof of Mandarin language skills (optional)
Please note that proof of English proficiency from digital learning platforms without official tests will not be accepted.
Internship certificates with relevant subject matter or proof of Mandarin language skills may be submitted as supporting documents.
3. Selection and nomination
Only applicants who meet the eligibility requirements and whose application documents have been submitted completely and correctly will be considered in the third phase. These applicants will be presented to the responsible selection committee for evaluation and selection.
Schedule of the Application and Selection Process
The application procedure takes place in three consecutive phases. The following deadlines apply to each phase:
1. Review of eligibility requirements
The application via Mobility Online and the upload of the Transcript of Records (TOR) must be completed no later than December 15, 2026, 12:00 p.m. CET. The review of eligibility requirements will be based on the submitted TOR. Applicants will be informed of their admission to the second application phase by January 15, 2027 at the latest.
2. Submission of complete application documents
Applicants who meet the eligibility requirements will then be given the opportunity to upload the remaining required application documents in Mobility Online. The complete documents must be submitted no later than January 29, 2027.
3. Selection and nomination
The complete and formally correct applications of admitted applicants will be presented to the responsible selection committee for evaluation and selection. Applicants can expect to be informed no earlier than the end of April 2027 as to whether they have been selected for participation in the program or for a place on the waiting list.
Please note: Please be aware that applications that do not meet the respective deadlines or that are submitted incompletely or in a formally incorrect manner cannot be considered.
Course Program at Host Institution (preliminary)
The study program at the Taiwanese host universities is expected to begin in early September 2027.
Courses at ➚National Yang Ming Chiao Tung University (NYCU)
Note: The links are for orientation purposes only; they refer to the courses of the winter semester 2026.
Module: Device & Integration
Module: Intelligent Manufacturing (3 von 4)
- ➚Operations Research (I)
- ➚Introduction to Machine Learning
- ➚Introduction to Computers and Programming
- ➚Introduction to Algorithms
Optional Courses:
- ➚Technological Innovation and Entrepreneurship Management
- ➚Creativity and Innovation Management
- ➚Introductory Chinese Conversation I
Courses at ➚National Taiwan University of Science and Technology (NTUST)
Note: The links are for orientation purposes only; they refer to the courses of the winter semester 2026.
Module: Equipment Engineering
- ➚Semiconductor Industry Insights and Practical Guidance (2 Taiwanese Credit Points)
- ➚Electronic Materials
- ➚Vacuum Technology and Plasma Science (3 Taiwanese Credit Points)
- ➚Wafer Fabrication Technology and Equipment (3 Taiwanese Credit Points)
- Optional Course: Mandarin (more courses can be picked from course program)
Courses at ➚National Taipei University of Technology (NTUT)
Note: The links are for orientation purposes only; they refer to the courses of the winter semester 2026.
Module: Master Program in Semiconductor Technology
- ➚Engineering of Films Coating
- ➚Nano Materials and Technology
- ➚Characterization Methods for Semiconductor Materials
- ➚Special Topics in Electronic Materials and Devices
Other courses:
- ➚Packaging Technology
- ➚Advances of Materials Properties
- ➚Solid State Physics
- ➚Special Topics of Materials Science and Engineering
- ➚Mechanical Behavior of Materials
- ➚Electron Microscopy
- ➚Special topics in nanomaterials synthesis
After completing the course program at the host university (around the end of December), you will begin the practical training at TSMC in the Newcomer Training Center and in the fab in Taichung. The exact dates will be announced in due time. The program is expected to end in mid-February 2028.
Summer Semester 2027 (Call closed)
Course Program (preliminary)
The STIPT program cooperates with various Taiwanese universities.
The course program for the summer semester 2027 will be conducted by National Taiwan University (NTU) and the National Cheng Kung University (NCKU) and consists of teaching modules highly relevant to the semiconductor industry.
The following modules are expected to be offered; any changes by the Taiwanese partner universities will be communicated promptly.
Courses at ➚National Taiwan University (NTU)
Module A: Device / Integration / Module
Module B: Tool / Equipment Engineering:
Module C: Intelligent Manufacturing:
- ➚Operations Research
- ➚Artificial Intelligence Programming with Python – For Beginners
- ➚Data Analysis and Machine Learning with Python
Courses at ➚National Cheng Kung University (NCKU)
Update: The following modules are offered especially for Master students. 3 credits can be obtained for each course.
Module: Process Technology (3 of 4):
- ➚Semiconductor Optoelectronic Physics and Devices (syllabus 2026)
- ➚Integrated 3D Nano and Micro Fabrication (syllabus 2026)
- ➚Materials And Devices for Sustainable Energy (syllabus 2025)
- ➚Microelectronic Fabrication Engineering (syllabus 2026)
Module: Equipment Engineering / Intelligent Manufacturing (3 of 4):
- ➚Introduction to Micromechanics (syllabus 2025)
- ➚Semiconductor Engineering (syllabus 2026)
- ➚Applied AI for Semiconductors: Hands-On Practice from Modeling to Agentic AI (new course)
- ➚Optimization and Reinforcement Learning (syllabus 2026)
Optional Course: College Chinese – Language Course
➚Link to Language Course (link leads to course level 1, all levels available based on a placement test during enrollment)
After completing the course program at the host university (around mid-June) you will start the training at TSMC in the Newcomer Training Center & the Fab in Taichung.
Schedule
- Application period: May 15, 2026 – June 15, 2026 (12:00 noon)
- Selection process and review by the selection committee: June -September 2026
- Announcement of selected students: October 2026 (tbc.)
- Arrival date for each Taiwanese university will be communicated in due course.
- Start of teaching period at Taiwanese partner universities: beginning of March 2027 – beginning of June 2027
- Practical training at TSMC: following the period of study, appr. starting Mid-June (tbc.)
- End of the program: tbc. August 2027
Contact:
Juan Manuel Barragan
STIPT project manager
Email: international.leosachsen@tu-dresden.de
Tel.: +49 351 463 37688
Feel free to connect with us online through ➚LinkedIn.
More questions regarding the application process?
Then join our online consultation on:
November 2 / 9 / 16 and 23, 2026
1.00 – 2.00 p.m.