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STIPT – Calls

WS 2026/27 (closed)
SS 2026 (closed)

Winter Semester 2026/27 (Call closed)

The call is closed. The next call will open mid-May 2026.

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Please submit your application for participation in the program online via Mobility Online within the period of the call. After submitting the application form, you will receive a registration request by email. You can then upload the following application documents online in the workflow section:

  • Certificate of enrollment
  • Transcript of Records (TOR)
  • Proof of your English language proficiency (at least B2 CEFR)
  • Bachelor’s degree certificate or preliminary diploma (if available)
  • Curriculum Vitae (CV) in English
  • Practical experience relevant to the semiconductor industry (optional)
  • Language skills in Mandarin (optional)

Electronic Reference

In addition, an electronic reference must be submitted by your home university until December 19, 2025. We will update the Workflow in Mobility Online in January 2026 – no worries in case you do not see the confirmation now. This must be written by a person relevant to your field of study (at least in the position of research associate), whom you designate in the application form. We recommend contacting this person in advance and informing her/him about the program, yourself, and your plans.

More detailed information can be found in the Mobility Online portal during application periods.


Please note:
All documents must be fully uploaded to Mobility Online no later than the application deadline. Unfortunately, incomplete applications cannot be considered. We therefore recommend that you submit your application early and do not wait until the last day. If you have any questions or need advice, please feel free to contact Leonardo-Sachsen.

Important note for Chinese citizens of the People’s Republic of China: Participation in the STIPT program requires the successful application for and issuance of all necessary visas and permits by the relevant authorities in Taiwan. It is generally not possible for citizens of the People’s Republic of China to obtain the appropriate visa for a stay in Taiwan. Please understand that applications from individuals who cannot be granted entry or work permits cannot be considered.

The current call for participation in the Semiconductor Talent Incubation Program Taiwan (STIPT) for the winter The current call for participation in the Semiconductor Talent Incubation Program Taiwan (STIPT) for the winter semester 2026 is open until December 12, 2025. We were offering an online information session for all interested students from eligible universities.

Speakers:

  • Josef Goldberger (Head of the Saxon Science Liaison Office in Taiwan) – Introduction to the STIPT program
  • Cherrie Chow, Manager, Division of International Collaboration, NYCU – Study conditions on site
  • Representative from TSMC – Insights into practical training at Fab15
  • STIPT alumnus – Experience report
  • Juan Manuel Barragan will also answer your questions about the application process.

In addition, during the application period, there were opportunities for online consultations November 10 and 17 as well as December 1, 1-2 p.m. (see contact box). 

Courses at ➚National Yang Ming Chiao Tung University (NYCU)

Please note: The links are provided for orientation purposes only; they refer to the courses offered in the winter semester 2025.

Modul: Device & Integration


Modul: Intelligent Manufacturing (3 von 4)


Optional Courses:

Courses at ➚National Taiwan University of Science and Technology (NTUST)

Please note: The links are provided for orientation purposes only; they refer to the courses offered in the winter semester 2025.

Modul : Equipment Engineering

Courses at National Tsing Hua University (NTHU)

  • Modul I Process integration: Chemical/Material Engineering
  • Modul II Semiconductor Device: Solid State Physics
  • practical training at TSMCS

Application period: November 15, 2025 – December 12, 2025 (12:00 noon)
Review of the documents by Leonardo-Sachsen: December 15, 2025 – January 30, 2026
Selection process by the selection committee: February 2, 2026 – February 27, 2026
Announcement of selected students: March, 2026
Arrival date for each Taiwanese university will be communicated in good time.
Start of teaching period at Taiwanese partner universities: September 1, 2026 (tbc.)
Practical training at TSMC: following the period of study until the beginning of the Chinese New Year (details will be provided in good time)

Summer Semester 2026 (Call closed)

Please submit your application for participation in the program online via Mobility Online. After submitting the application form, you will receive a registration request by email. You can then upload the following application documents online in the workflow section:

  • Certificate of enrollment
  • Transcript of records
  • Proof of your English language proficiency
  • Bachelor’s degree certificate or preliminary diploma
  • Practical experience relevant to the semiconductor industry (optional)
  • Language skills in Mandarin (optional)


In addition, an electronic reference must be submitted by your home university. This should be written by a person relevant to your field of study, whom you designate in the application form. We recommend contacting this person in advance and informing her/him about the program, yourself, and your plans.

More detailed information can be found in the Mobility Online portal during application periods.

Through STIPT the Saxon universities cooperate with various Taiwanese universities. The course program for the summer semester 2027 will be conducted by National Taiwan University (NTU) and consists of teaching modules highly relevant to the semiconductor industry. The following modules are expected to be offered. Changes remain at the discretion of the Taiwanese partner university and will be communicated as soon as they become known:

Modul Device / Integration:

  • Solid State Electronics
  • Integrated Circuit Technology
  • Strength of Materials
  • Practical Training at TSMC


Modul Tool / Equipment Engineering:

  • Integrated Circuit Technology
  • Electronic Circuits
  • Digital Control System
  • Practical Training at TSMC


Modul Intelligent Manufacturing

  • Operations Research
  • Artificial Intelligence
  • Machine Learning
  • Practical Training at TSMC


To harmonize the German exam period, which usually lasts until the end of February, with the spring semester in Taiwan, which usually begins in mid-February, the STIPT course program starts in February with online modules. From the beginning of March, the course program continues in Taiwan with mandatory in-person attendance. Therefore, arrival in Taiwan can take place either Mid-February or March 1, depending on the individual participants preference.

After completing the course program at the host university (around mid-June), the transition takes place to a two-month practical training at TSMC in the Newcomer Training Center & Fab in Taichung.

Application period via Mobility Online: May 1 (four weeks)

First arrival date: February 21, 2026 

Online courses:  February 23, 2026 – February 29, 2026

(Participation is a mandatory part of the scholarship program. These courses can be completed either in Germany or already in Taiwan. Important: If participation in the online courses is not possible during the exam period, further participation in the STIPT program is excluded.)

Second arrival date:
March 1, 2026

In-person courses at the Taiwanese partner universities:
March 2, 2026 – June 5, 2026

Practical training at TSMC:
Mitte June – 14 August 2026

Program Information
Information for Participants

Contact:

Juan Manuel Barragan
Project Manager STIPT

Email: international.leosachsen@tu-dresden.de
Tel.: +49 351 463 37688

Feel free to connect with us online through ➚LinkedIn.