STIPT – Calls

Summer Semester 2027 (Call opens May 15, 2026)

The call opens May 15 (open until June 15, 2026, at 12 noon).

Please submit your application for participation in the program online ➚via Mobility Online within the period of the call.

After submitting the application form, you will receive a registration request by email. You can then upload the following application documents online in the workflow section:

Mandatory documents:

  • Certificate of enrollment
  • Transcript of records (TOR) with the courses relevant to the field of semiconductors clearly marked or highlighted; All courses you have listed in the application form must be supported by the uploaded TOR document ➚Guideline to calculate the grade average
  • Curriculum Vitae (CV) in English
  • Bachelor’s degree certificate or preliminary diploma (if available)
  • English language proficiency proof (B2 CEFR):
    • Official tests and certificates (IELTS, TOEIC, Cambridge, etc.)
    • Evidence of English language skills from organizations or universities (such as DAAD, Education First, university certificates, German Abitur).
    • Evidence of passed English language module (in Transcript of Records)
    • Native speakers: ➚Declaration on Honour 


Please note that you cannot provide any proofs of English proficiency from digital learning platforms without an official test.

You may submit additional documents such as internship certificates relevant to the semiconductor industry or Mandarin language certificates.

In addition, you need an electronic reference by a professor or another member of the teaching staff in your field of study of the university you are enrolled in (to be handed in until the end of June 2026). Every applicant designates the person in the application form. Please contact this person in advance and inform her/him about the program, yourself, and your plans.

More detailed information can be found in the Mobility Online portal during application period.

Please note:
All documents must be fully uploaded to ➚Mobility Online no later than the application deadline. Unfortunately, incomplete applications cannot be considered.

We will offer an online information session for all interested students from eligible universities on May 19, 2026 at 9 a.m.

This session will provide details on the program, the application process, and will feature a short presentation on the STIPT program at NCKU and TSMC.

➚Link for registration

There will be additional online information sessions (guidance in your application process) with Leonardo-Sachsen on April 28, on May 5 and on May 22 at 3 p.m. (see contact box)

The STIPT program cooperates with various Taiwanese universities.

The course program for the summer semester 2027 will be conducted by National Taiwan University (NTU), the National Yang Ming Chiao Tung University (NYCU) and the National Cheng Kung University (NCKU) and consists of teaching modules highly relevant to the semiconductor industry.

The following modules are expected to be offered; any changes by the Taiwanese partner universities will be communicated promptly.

Courses at National Taiwan University (NTU) – tbc.

Module: Device / Integration:

  • Solid State Electronics
  • Integrated Circuit Technology
  • Strength of Materials
  • Practical Training at TSMC


Module: Tool / Equipment Engineering:

  • Integrated Circuit Technology
  • Electronic Circuits
  • Digital Control System
  • Practical Training at TSMC


Module: Intelligent Manufacturing:

  • Operations Research
  • Artificial Intelligence
  • Machine Learning
  • Practical Training at TSMC

 

Courses at National Yang Ming Chiao Tung University (NYCU) – tbc.

Module: Device and Integration:

  • Semiconductor Physics and Devices (I)
  • Semiconductor Processings
  • Energy Materials and Devices
  • Practical Training at TSMC

 

Module: Intelligent Manufacturing (3 of 4):

  • Operations Research (I)
  • Introduction to Machine Learning
  • Introduction to Computers and Programming
  • Introduction to Algorithms 
  • Practical Training at TSMC

Optional Courses:

  • Technological Innovation and Entrepreneurship Management
  • Creativity and Innovation Management
  • Introductory Chinese Conversation I

 

Courses at ➚National Cheng Kung University (NCKU)  tbc.

Module: Process Technology (3 of 4):

  • Semiconductor Optoelectronic Physics and Devices
  • Integrated 3D Nano and Micro Fabrication 
  • Materials And Devices for Sustainable Energy
  • Microelectronic Fabrication Engineering

 

Module: Equipment Engineering / Intelligent Manufacturing (3 of 4):

  • Introduction to Micromechanics
  • Semiconductor Engineering
  • Big Data Analysis and Cloud Computing
  • Optimization and Reinforcement Learning

 

After completing the course program at the host university (around mid-June) you will start the training at TSMC in the Newcomer Training Center & the Fab in Taichung.

  • Application period: May 15, 2026 – June 15, 2026 (12:00 noon)
  • Selection process and review by the selection committee: June -September 2026 
  • Announcement of selected students: October 2026 (tbc.)
  • Arrival date for each Taiwanese university will be communicated in due course.
  • Start of teaching period at Taiwanese partner universities: beginning of March 2027 – beginning of June 2027
  • Practical training at TSMC: following the period of study, appr. starting Mid-June (tbc.)
  • End of the program: tbc. August 2027

Winter Semester 2026/27 (Call closed)

The call is closed. The next call will open mid-May 2026.

Please submit your application for participation in the program online via Mobility Online within the period of the call. After submitting the application form, you will receive a registration request by email. You can then upload the following application documents online in the workflow section:

  • Certificate of enrollment
  • Transcript of Records (TOR)
  • Proof of your English language proficiency (at least B2 CEFR)
  • Bachelor’s degree certificate or preliminary diploma (if available)
  • Curriculum Vitae (CV) in English
  • Practical experience relevant to the semiconductor industry (optional)
  • Language skills in Mandarin (optional)

Electronic Reference

In addition, an electronic reference must be submitted by your home university until December 19, 2025. We will update the Workflow in Mobility Online in January 2026 – no worries in case you do not see the confirmation now. This must be written by a person relevant to your field of study (at least in the position of research associate), whom you designate in the application form. We recommend contacting this person in advance and informing her/him about the program, yourself, and your plans.

More detailed information can be found in the Mobility Online portal during application periods.


Please note:
All documents must be fully uploaded to Mobility Online no later than the application deadline. Unfortunately, incomplete applications cannot be considered. We therefore recommend that you submit your application early and do not wait until the last day. If you have any questions or need advice, please feel free to contact Leonardo-Sachsen.

Important note for Chinese citizens of the People’s Republic of China: Participation in the STIPT program requires the successful application for and issuance of all necessary visas and permits by the relevant authorities in Taiwan. It is generally not possible for citizens of the People’s Republic of China to obtain the appropriate visa for a stay in Taiwan. Please understand that applications from individuals who cannot be granted entry or work permits cannot be considered.

The current call for participation in the Semiconductor Talent Incubation Program Taiwan (STIPT) for the winter The current call for participation in the Semiconductor Talent Incubation Program Taiwan (STIPT) for the winter semester 2026 is open until December 12, 2025. We were offering an online information session for all interested students from eligible universities.

Speakers:

  • Josef Goldberger (Head of the Saxon Science Liaison Office in Taiwan) – Introduction to the STIPT program
  • Cherrie Chow, Manager, Division of International Collaboration, NYCU – Study conditions on site
  • Representative from TSMC – Insights into practical training at Fab15
  • STIPT alumnus – Experience report
  • Juan Manuel Barragan will also answer your questions about the application process.

In addition, during the application period, there were opportunities for online consultations November 10 and 17 as well as December 1, 1-2 p.m. (see contact box). 


Courses at ➚National Yang Ming Chiao Tung University (NYCU)

Please note: The links are provided for orientation purposes only; they refer to the courses offered in the winter semester 2025.

Modul: Device & Integration


Modul: Intelligent Manufacturing (3 von 4)


Optional Courses:

Courses at ➚National Taiwan University of Science and Technology (NTUST)

Please note: The links are provided for orientation purposes only; they refer to the courses offered in the winter semester 2025.

Modul : Equipment Engineering

Contact:

Juan Manuel Barragan &
Pauline Fiore

STIPT Team

Email: international.leosachsen@tu-dresden.de
Tel.: +49 351 463 37688

Info sessions for students about the application process on April 28, May 5 and May 22, 2026 at 3 p.m. (➚Link for participation)

Feel free to connect with us online through ➚LinkedIn.