Students and Graduates 〉 Internships abroad 〉 STIPT 〉 Calls
STIPT – Calls
Winter Semester 2027/28 (Call will open November 15, 2026)
STIPT-Online Information Event November 27, 2026 at 9 a.m. (Please, register!)
The information event for students provides insight into the STIPT program and will feature representatives from NTUST and TSMC as speakers. We kindly ask you to ➚register before the event; the participation link will be sent out in due time.
Date and Time: November 27, 2026, 9:00 a.m.
Further information and registration: ➚Event details and registration
Application (from November 15 until December 15, 2026)
The link to the application platform will be available at this location starting November 15, 2026.
Note: The entire application process takes place in English. Please complete your application in the portal entirely in English and submit your documents in English – where possible.
Please submit your application for participation in the program online via Mobility Online. After submitting the application form, you will receive a registration request by email.
The application and selection process consists of three phases:
1. Verification of eligibility requirements
After registering, please first upload only your Transcript of Records (TOR) – preferably in the English version – for your current study program. Based on the TOR, we will check whether you meet the formal requirements for participation. A grade average of 2.3 (German scale) or better is required to continue in the selection process. For the calculation of the grade point average, please refer to the ➚guide to calculating your grade average.
2. Submission of application requirements
Applicants who meet the eligibility requirements will be admitted to the second phase and will be able to upload the remaining application documents via the workflow section in Mobility Online.
These include:
- Certificate of enrollment
- Curriculum vitae (CV) in English
- Proof of your English proficiency (B2 CEFR):
- Official tests and certificates (e.g., IELTS, TOEIC, Cambridge, etc.)
- Proof of English proficiency issued by organizations or universities (e.g., DAAD, Education First, university certificates, German Abitur)
- Proof of a passed English module (as shown in your TOR)
- Bachelor’s degree certificate or pre-diploma (Vordiplom) (optional)
- Letter of recommendation from a qualified person in your field (e.g., professor, research associate, etc.); a mentor or employer from the field of microelectronics, in English (optional)
- Documentation of practical experience relevant to the semiconductor industry (preferably in English, optional)
- Proof of Mandarin language skills (optional)
Please note that proof of English proficiency from digital learning platforms without official tests will not be accepted.
Internship certificates with relevant subject matter or proof of Mandarin language skills may be submitted as supporting documents.
3. Selection and nomination
Only applicants who meet the eligibility requirements and whose application documents have been submitted completely and correctly will be considered in the third phase. These applicants will be presented to the responsible selection committee for evaluation and selection.
Schedule of the Application and Selection Process
The application procedure takes place in three consecutive phases. The following deadlines apply to each phase:
1. Review of eligibility requirements
The application via Mobility Online and the upload of the Transcript of Records (TOR) must be completed no later than December 15, 2026, 12:00 p.m. CET. The review of eligibility requirements will be based on the submitted TOR. Applicants will be informed of their admission to the second application phase by January 15, 2027 at the latest.
2. Submission of complete application documents
Applicants who meet the eligibility requirements will then be given the opportunity to upload the remaining required application documents in Mobility Online. The complete documents must be submitted no later than January 29, 2027.
3. Selection and nomination
The complete and formally correct applications of admitted applicants will be presented to the responsible selection committee for evaluation and selection. Applicants can expect to be informed no earlier than the end of April 2027 as to whether they have been selected for participation in the program or for a place on the waiting list.
Please note: Please be aware that applications that do not meet the respective deadlines or that are submitted incompletely or in a formally incorrect manner cannot be considered.
Course Program at Host Institution (preliminary)
The study program at the Taiwanese host universities is expected to begin in early September 2027.
Courses at ➚National Yang Ming Chiao Tung University (NYCU)
Note: The links are for orientation purposes only; they refer to the courses of the winter semester 2026.
Module: Device & Integration
Module: Intelligent Manufacturing (3 von 4)
- ➚Operations Research (I)
- ➚Introduction to Machine Learning
- ➚Introduction to Computers and Programming
- ➚Introduction to Algorithms
Optional Courses:
- ➚Technological Innovation and Entrepreneurship Management
- ➚Creativity and Innovation Management
- ➚Introductory Chinese Conversation I
Courses at ➚National Taiwan University of Science and Technology (NTUST)
Note: The links are for orientation purposes only; they refer to the courses of the winter semester 2025.
Module: Equipment Engineering
- ➚Semiconductor Fabrication (3 Taiwanese Credit Points)
- ➚Vacuum and Plasma Techniques (3 Taiwanese Credit Points)
- ➚Wafer Fabrication Technology and Equipment (3 Taiwanese Credit Points)
- Optional Course: Mandarin (more courses can be picked from course program)
Courses at ➚National Taipei University of Technology (NTUT)
Note: The links are for orientation purposes only; they refer to the courses of the winter semester 2026.
Module: Master Program in Semiconductor Technology
- ➚Engineering of Films Coating
- ➚Nano Materials and Technology
- ➚Characterization Methods for Semiconductor Materials
- ➚Special Topics in Electronic Materials and Devices
Other courses:
- ➚Packaging Technology
- ➚Advances of Materials Properties
- ➚Solid State Physics
- ➚Special Topics of Materials Science and Engineering
- ➚Mechanical Behavior of Materials
- ➚Electron Microscopy
- ➚Special topics in nanomaterials synthesis
After completing the course program at the host university (around the end of December), you will begin the practical training at TSMC in the Newcomer Training Center and in the fab in Taichung. The exact dates will be announced in due time. The program is expected to end in mid-February 2028.
Summer Semester 2027 (Call closed)
Application
The call is closed. The next call will open mid November.
Please submit your application for participation in the program online via Mobility Online within the period of the call.
After submitting the application form, you will receive a registration request by email. You can then upload the following application documents online in the workflow section:
Mandatory documents:
- Certificate of enrollment
- Transcript of records (TOR) of your current study program with the courses relevant to the field of semiconductors clearly marked or highlighted; All courses you have listed in the application form must be supported by the uploaded TOR document ➚Guideline to calculate the grade average
- Curriculum Vitae (CV) in English
- Bachelor’s degree certificate or preliminary diploma (if available)
- English language proficiency proof (B2 CEFR):
- Official tests and certificates (IELTS, TOEIC, Cambridge, etc.)
- Evidence of English language skills from organizations or universities (such as DAAD, Education First, university certificates, German Abitur).
- Evidence of passed English language module (in Transcript of Records)
- Native speakers: ➚Declaration on Honour
Please note that you cannot provide any proofs of English proficiency from digital learning platforms without an official test.
You may submit additional documents such as internship certificates relevant to the semiconductor industry or Mandarin language certificates.
Electronic Reference
In addition, you need an electronic reference by a professor or another member of the teaching staff in your field of study of the university you are enrolled in (to be handed in until the end of June 2026).
The electronic reference consists of a short questionnaire regarding technical knowledge and specific experience in the field of semiconductor technology. Additionally, there is a field for an assessment of the applicant, particularly regarding personal qualities and their suitability for participation in the STIPT program. A separate letter of recommendation or additional documents are not required. The reference is completed and submitted exclusively via the link sent by email to the reference person.
Every applicant designates the person in the application form. Please contact this person in advance and inform her/him about the program, yourself, and your plans.
More detailed information can be found in the Mobility Online portal during application period.
Please note:
All documents must be fully uploaded to ➚Mobility Online no later than the application deadline. Unfortunately, incomplete applications cannot be considered.
Course Program (preliminary)
The STIPT program cooperates with various Taiwanese universities.
The course program for the summer semester 2027 will be conducted by National Taiwan University (NTU) and the National Cheng Kung University (NCKU) and consists of teaching modules highly relevant to the semiconductor industry.
The following modules are expected to be offered; any changes by the Taiwanese partner universities will be communicated promptly.
Courses at ➚National Taiwan University (NTU) – tbc.
Module: Device / Integration:
- ➚Solid State Electronics
- ➚Integrated Circuit Technology
- ➚Strength of Materials
Module: Tool / Equipment Engineering:
- ➚Integrated Circuit Technology
- ➚Electronic Circuits
- ➚Digital Control System
Module: Intelligent Manufacturing:
- ➚Operations Research
- ➚Artificial Intelligence
- ➚Machine Learning
Courses at ➚National Cheng Kung University (NCKU)
Module: Process Technology (3 of 4):
- ➚Semiconductor Optoelectronic Physics and Devices
- ➚Integrated 3D Nano and Micro Fabrication
- ➚Materials And Devices for Sustainable Energy
- ➚Microelectronic Fabrication Engineering
Module: Equipment Engineering / Intelligent Manufacturing (3 of 4):
- ➚Introduction to Micromechanics
- ➚Semiconductor Engineering
- ➚Big Data Analysis and Cloud Computing
- ➚Optimization and Reinforcement Learning
Optional Course: College Chinese
➚Link to Language Course (link leads to course level 1, all levels available based on a placement test during enrollment)
After completing the course program at the host university (around mid-June) you will start the training at TSMC in the Newcomer Training Center & the Fab in Taichung.
Schedule
- Application period: May 15, 2026 – June 15, 2026 (12:00 noon)
- Selection process and review by the selection committee: June -September 2026
- Announcement of selected students: October 2026 (tbc.)
- Arrival date for each Taiwanese university will be communicated in due course.
- Start of teaching period at Taiwanese partner universities: beginning of March 2027 – beginning of June 2027
- Practical training at TSMC: following the period of study, appr. starting Mid-June (tbc.)
- End of the program: tbc. August 2027
Contact:
Juan Manuel Barragan
STIPT project manager
Email: international.leosachsen@tu-dresden.de
Tel.: +49 351 463 37688
Feel free to connect with us online through ➚LinkedIn.
More questions regarding the application process?
Then join our online consultation on:
November 2 / 9 / 16 and 23, 2026
1.00 – 2.00 p.m.